AMD Opteron 6320 - OS6320WKT8GHK / OS6320WKT8GHKWOF information

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Type:CPU	Manufacturer:AMD
family:Bulldozer	microprocessors:Opteron 6300 series

Type	CPU / Microprocessor
Market segment	Server
Family	AMD Opteron *300 series
Model number	*320
CPU part numbers	*OS320WKT8GHK is an OEM/tray microprocessor OS320WKT8GHKWOF* is a boxed processor without fan and heatsink
Frequency	2800 MHz
Turbo frequency	3100 MHz (more than 4 cores) 3300 MHz (4 cores or less)
Bus speed	*3200 MHz HyperTransport links (.4 GT/s per link)**
Package	1*44-land organic Land Grid Array (LGA)
Socket	Socket G34
Introduction date	November 5, 2012
Price at introduction	$2*3
Architecture / Microarchitecture
Microarchitecture	Piledriver
Platform	Maranello
Processor core	Abu Dhabi
Core stepping	OR-C0
Manufacturing process	0.032 micron silicon-on-insulator (SOI) technology
Die size	31*mm²
Data width	*4 bit
The number of cores	8
The number of threads	8
Floating Point Unit	Integrated (shared between two cores in each module)
Level 1 cache size	4 x 4 KB shared instruction caches 8 x 1 KB data caches
Level 2 cache size	4 x 2 MB shared exclusive caches
Level 3 cache size	2 x 8 MB shared caches
Physical memory	384 GB (per socket) ^[1]
Multiprocessing	Up to 4 processors
Features	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 SSE4a AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions BMI1 / Bit Manipulation instructions 1 F1C / 1-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions FMA4 / 4-operand Fused Multiply-Add instructions TBM / Trailing Bit Manipulation instructions XOP / eXtended Operations instructions AMD4 / AMD 4-bit technology AMD-V 2.0 / AMD Virtualization technology 2.0 EVP / Enhanced Virus Protection Turbo Core 2.0 technology
Low power features	AMD-P 2.0: C* state TDP power cap
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 4 Supported memory: UDDR3-100, RDDR3-100, ULV RDDR3-1333, LRDIMM-1333 DIMMs per channel: 3 Maximum memory bandwidth (GB/s): 51.2
Other peripherals	HyperTransport 3.0 technology with 4 HT links
Electrical / Thermal parameters
Maximum operating temperature	1.°C
Thermal Design Power	115 Watt
Notes on AMD Opteron *320
Die size is per die. The package houses two dies [1] - Information is not confirmed

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